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    Sensitive elemental analysis completed with a quantitative chemical analysis is indispensable for preparing good quality thin layers. Moreover, the precise characterization of the substrate surface is also a necessary prerequisite guarantee of the desired qualities of coating. Detailed knowledge of the interfaces within a layered structure or between a thin layer and a substrate can play a decisive role in ensuring the desired functional properties of a thin layer structure. A Secondary Neutral Mass Spectrometer (SNMS) supplemented with a Secondary Ion Mass Spectrometer (SIMS) is an ideal equipment to perform quantitative depth profile analysis of thin films. While SNMS can be used to produce high depth resolution, SIMS is suitable for producing high lateral resolution. Since we can use very low ion bombardment energies while the sample current densities are uniform over the entire analysed area, the resolution of the depth profile analysis is in the range of the atomic scale.

    Depth profiling is one of the most powerful methods to determine the depth distribution of atomic compositions. It can be performed by ion sputtering which is a destructive method where particles are removed from the surface. During ion sputtering the flux of sputtered particles consists of ions and atoms. Neutral atoms are detected by post-ionization performed by ECWR (Electron Cyclotron Wave Resonance) plasma. Analytical information is obtained in two ways. First, the particles removed from the surface are directly detected by a mass spectrometric technique. Secondly, after ion bombardment the surface is investigated by other techniques. The analytical information obtained with the different techniques may be different considerably, since a preferential removal of certain species from the surface may sometimes cause drastic deviation from the original surface composition. A complete quantitative analysis of a surface is possible if these methods are combined and completed with electron microscopy measurements (TEM, SEM), X-Ray diffraction and electron spectroscopic techniques (Auger, XPS).

    Below you can find the list of material analysis techniques applied at ATOMKI and Department of Solid State Physics of Debrecen University. Using all these techniques we can perform a complete quantitative analysis of surfaces and thin layers in order to determine the sample composition with high depth resolution and lateral distribution. We will be happy to answer further queries. Services Price List (HUN) (ENG)

Technical description of the SNMS

		Transmission Electron Microscopy (TEM)			Scanning Electron Microscopy (SEM)
	TEM is a microscopy technique whereby a beam of electrons is transmitted through an ultra thin specimen. An image is formed from interaction of the transmitted electrons and the specimen, magnified and focused by the electromagnetic lens and appears on a fluorescent screen. More information...			The SEM is a type of electron microscope that images the sample surface by scanning it with a high-energy electron beam. The incident electrons interact with the atoms of the sample producing signals that contain information about the surface topography, composition and other properties such as electrical conductivity. More information

		X-Ray Diffraction			XPS, Auger-spectroscopy
	X-Ray diffraction is a non-destructive analysis method for characterization of  any materials including metals, minerals, plastics, pharmaceuticals and semiconductors. More information			The electron spectroscopic techniques such as photoelectron or Auger electron spectroscopy, supply analytical information derived from the kinetic energy distribution of electrons released from surface atoms. More information

		Scanning Probe Microscopy (STM, AFM)			AMBIOS XP-I profilometer
	More information... Contact person:  Dr. István Szabó E-mail: iaszabo@tigris.unideb.hu			With AMBIOS XP-I profilometer we are able to measuring surface flatness, waviness and topography in nanometer vertical resolution with stylus loads from 10 mg down to 0.05 mg. More information...

		Magnetron sputtering			Ball milling
	Magnetron sputtering is a powerful and flexible technique which can be used to coat the surface with a wide range of materials - any solid metal or alloy and a variety of compounds. In a sputtering process particles (atoms or ions) of a solid target are removed by ion bombardment. More information			The ball milling is a method of grinding and mixing material, with or without liquid, in a rotating cylinder or conical mill partially filled with grinding media such as balls or pebbles.      It is widely used in powder-making production. This is a very efficient tool for grinding many materials into a fine powder. More information

		Low temperature physics laboratory
	The laboratory consists of a cryotechnic supply system and low temperature experimental equipments. The most important part of the cryo-system is a helium liquifier, which can produce 40 l of liquid helium per hour. It is also connected with a gas collecting pipe system networked in most laboratories of the institute. The system supplies external users as well. More information...